【工作內容】 1.投入無機複合材料合成試量產，包含材料合成、表面改質、性質分析等，並執行實驗計畫。 2.負責研究設備操作、維護及管理，確保實驗流程順利進行。 【工研院材化所~熱情招募中】 我們擁有充足的研發資源，打造菁英研發環境，鼓勵創新求變，豐富技術視野 熱情邀請具材料/化學/化工/電機等專業能力的你加入，展開研發菁英旅程 #綠色科技 #淨零碳排 #永續環境

1. Manage and maintain Windows servers and VMware environments. 2. Administer and support storage systems. 3. Plan and implement office IT infrastructure and equipment (OA systems). 4. Provide IT helpdesk support for end users.

1. 廠房之消防、空調、水電...等設備保養及維修 2. 工程新建、改善及效能提升

1. 廠辦清潔、修繕、 庶務及辦公室規劃等總務類管理 2. 組織溝通管理、組織氛圍調查等專案執行 3. 福委會運作暨福利活動執行 4. 主管交辦與專案規劃執行

1. 機構零件材料規格確認、料號建立與零件變更審核管理 2. 零件問題分析與參數標準建立 3. 供應商零件承認作業溝通與流程管理 4. 零件無有害物質審查管理

1. 海外客戶訂單與國際展覽需求訂單管理 2. 出貨安排及收款等國貿相關事宜工作 3. 與客戶、內部業務、產銷訂單安排溝通協調 1. Responsible for order delivery and logistics related process among customers, production and forwarders; 2. Regularly review sales order status and account receivable as KPI.

協助執行專管業務、工地現場監管並整理文件

1.建立與維護員工關係 2.員工關懷企劃與執行 3.與Legal、Compliance合作，處理員工申訴與爭議解決 4.人資部其他專案執行或主管交辦事項

活動報名: https://appliedmaterials.eightfold.ai/events/candidate/landing?plannedEventId=Mm41OZeRL 【活動亮點】 透過闖關親身體驗客戶技術支援工程師＆全球裝機工程師職務內容: －從工具使用到無塵服體驗的真實職場情境，展現先進且核心的技術專業，感受滿滿成就感 －體驗應材工作日常，與團隊一起鍛鍊邏輯思考、溝通排除故障、破解挑戰 探索高科技產業的職涯機會與專業發展: －應材學長姐現身分享，傳授職場發展的關鍵眉角 －部門主管全程參與，近距離互動解密，啟發你未來無限可能 把握優先現場面試機會: －當天能參與現場面試，展示你的「應」實力，為職涯鋪路 －現場填寫問卷就有機會抽中AirPods Pro -------------------------------------------------------------------- 報名後會經過書審及電話面談，符合資格者將另外通知活動參與資格。 報名需附上完整履歷表，中英文不拘（請將所有文件整理成一份PDF） 若有英文檢定成績(TOEIC/IELTS/TOEFL)，請附上成績單 社會新鮮人：請在履歷註明學士及碩士在校成績(GPA)、並提供自傳 【報名及甄選流程】 報名：即日起至04/13 (日) HR電話訪談：4月底前 獲選活動資格通知：5/9(五)前

Apply here: https://micron.wd1.myworkdayjobs.com/External/job/Hsinchu-Taiwan/Principal-Engineer---DRAM-Module-Eng--HVM-_JR76864 As a DRAM Module HVM Engineer with Central Engineering, DRAM Module and CXL (DMC) group, you will play a crucial role in ensuring the reliability and performance of DRAM Module and CXL products. You will be responsible for addressing customer Return Material Authorizations (RMA) and resolving factory issues, as well as contributing to the design and development of new hardware products. Job Responsibilities: Customer support: Work with GQ, FAE and MFG team on customer escalation and to provide technical guidance driving timely and effective solutions. Resolution of RMA: Work with cross functional team to resolve customer return and customer escalation. Collaboration: Ability to work in a technical lead role independently and with the global cross-functional teams. Collaborate with the customer support team to provide timely and effective solutions. Technical Leadership: Provide technical leadership to support DRAM module activities from NPI to HVM on hardware design-related issues, engage with Design to close FMEA, DFM and DFT issues. Risk Management: Conduct monthly fail-mode analysis and risk assessment from MFG sites and work closely with Design, MFG, GQ, and other engineering team to resolve failures, running DOE, systematically improving both MFG processes and Module Design. Module NPI-HVM: Support product safe launch and certification activities, NPI, HVM manufacturing, including product/MFG processes transfer from design to manufacturing. Skills & Experience A Bachelor/Master’s degree in Electronics / Mechanical Engineering with 8+ Year of relevant work Experience. Experienced in working end to end of a product cycle in hardware design including hardware architect, circuit design, Debugging, Manufacturing and assembling. Excellent relevant experience with DRAM module, PMIC, SPD hub and RCD, high-speed interfaces DDR, and communication protocols such as I2C and I3C. Good understanding of High-speed board design, SI and PI concepts, well experienced in system bring-up, characterization and debugging as well as knowledge of laboratory equipment such as oscilloscopes and logic and protocol analyzers. Proficiency in programming languages such as C/C++/ Python, JIRA and Confluence. Candidate with CXL working experience will be advantageous. Work on site in Hsinchu Taiwan with regional Asia travel.