職務說明 1. 晶圓級封裝設備: 濕製程/黃光等機台日常保養與維護。 2. 常日班 / 四班二輪日夜輪值，維持機台正常生產。 3. 機台異常報告及Trouble shooting SOP撰寫。 4. Tool Utilization & MTBA & MTBF Improvement。 5. 針對重大異常撰寫8D Report並進行立即性改善對策。 6. 維修成本管理與機台料件請購控管。 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。 ＊上班時段: 常日班(08:30~17:30) / 四班二輪(08:30~20:30 / 20:30~08:30)

【Customer Engineering Account Management】 (1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery (2)Offer industrial leader’s advanced package solutions and services through integration of package and process development 【Project management】 (1)Project phase in schedule arrangement and follow up (2)SWR arrangement ,schedule follow up, negotiation…etc. (3)PKD/PMD creation (PLM) (4)Reliability arrangement 【Team Work】 (1)To optimize resource allocation (2)Enhance teamwork in 360° including customer, supplier and our colleagues (3)Develop self and others

*此職務須輪班(做二休二，每三個月日夜班輪調一次) 1. 機台設備保養、維修、校正 （模組SMT機台：置件機、迴焊爐、AOI 等相關機台） 2. 機台設備異常處理 3. 處理機台維修及追蹤機台狀況 4. 落實主管及工程師交接事項與每日機台狀況交接報告 5. 線上操作員之教育訓練 6. 協助設備安裝移機 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

1.執行機台預防保養 2.機台維修與異常解決 3.機台能力提升 4.無經歷可，有AOI/BHI/OMS/FIB等檢驗機台相關經驗尤佳 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。 ＊上班時段: 常日班(08:30~17:30) / 四班二輪(08:30~20:30 / 20:30~08:30)

1.對內進行生產排程與規劃 2.對外維護客戶關係 3.確認客戶端生產需求 4.跨部門溝通合作 ※ 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘； ※ 資深人員薪資另議。

1.ISO環境管理系統建置/推行/維護。 2.順應法規、客戶要求、國際趨勢等，建立環境永續指標、方案。 3.各廠環境目標標的訂定與追蹤。 4.各廠區廢棄物分類儲存管理、教育訓練。 5.環保法規查核，並依查核結果提出管理或降低環境風險之改善措施或因應對策。 6.廠區環保相關(廢棄物、空污、水污、毒化物)相關法定申報與文件撰寫、送審。 7.廠區環境自主監測評估、分析及環境監督量測與改善。 8.溫室氣體盤查與驗證、氣候變遷相關方案與問卷填寫。 9.定期/不定期廠區環境相關巡檢稽核。 ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

1. Quality system management (品質管理系統維持與運作) 2. Coordinate management committee.(跨部門委員會) 3. Coordinate and maintain Green Product System and customer GP issue (GP/無有害物質管理) 4.PCN control (工程變更管理) 5.Supplier chain GP control & HSPM audit (供應鏈GP/ 無有害物質管理) 6.Coordinate ISO50001 / ISO17025 / ISO27001external audit & Support SA8000/ISO37001/ISO22301/ RBA internal/external audit ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。

Main work content: 1. Fan-out structure/ material/ process flow design 2. Fan-out RDL layout drawing review 3. Packaging direct material survey, evaluation, improvement & qualification 4. Design rule establishment & maintenance 5. Package failure analysis 6. Coordinate & lead project in design portion & co-work with process, integration & simulation teams 7. Direct communication with customers * 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 * 資深人員薪資另議。

This position is responsible for resolving customer quality related issues and acting to resolve quality problems.This team will act as a key point of communication with customers on subjects as examples but not limited to customer complaints, customer requests. If have over 1 years quality related experience will be preferred. 【Key Responsibilities】 1.Customer claim and CAR disposition & follow-up. 2.Customer audit arrangement and finding follow-up. 3.Regular audit report preparation and meeting with customer. 4.Interface between PTI & customer on quality issue. 5.Strengthen customer relationship. 6.Satisfy customer on quality service. 【Problem Solving】 Recognizes and solves typical problems that can occur in own work area; evaluates and selects solutions from established options 【Interpersonal Skills】 Uses communication skills to exchange information; fluent English skill is perfect. TOEIC at least 600.

1. Electrical package warpage and component stress simulation and analysis (FBGA, FCBGA, FOWLP, FOPLP, 3D IC CIS CSP, TSOP, QFN, QFP......). 2. Electrical package thermal simulation and analysis (JESD51 standard). 3. Electrical package mold flow and wire sweep simulation and analysis. 4. Board level drop test experiment and analysis (JESD22-B111 standard). 5. Warpage measurement by shadow moire (JESD22-B112 standard). 6. Database establishment and utility development. 7. New simulation capability development. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 ＊資深人員薪資另議。